PRESSURE SENSOR, MANUFACTURING METHOD THEREFOR AND PRESSURE MEASURING DEVICE

An MEMS pressure sensor, a manufacturing method therefor and a pressure measuring device. The MEMS pressure sensor comprises: an adapter board; an integrated circuit chip provided on one side of the adapter board; and a sensor chip provided on the side of the adapter board facing away from the integ...

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Bibliographische Detailangaben
Hauptverfasser: HE, Nana, DING, Ding, WANG, Lihui, ZHANG, Taonan, REN, Yanfei, SUN, Jie, GUO, Weilong, LI, Yue, WU, Shaohua, DU, Guochen, WEI, Qiuxu, QU, Feng, CHANG, Wenbo
Format: Patent
Sprache:chi ; eng ; fre
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Zusammenfassung:An MEMS pressure sensor, a manufacturing method therefor and a pressure measuring device. The MEMS pressure sensor comprises: an adapter board; an integrated circuit chip provided on one side of the adapter board; and a sensor chip provided on the side of the adapter board facing away from the integrated circuit chip. The sensor chip comprises a first electrode and a second electrod, and the first electrode is arranged between the adapter board and the second electrode. The second electrode comprises a pressure sensing part opposite to the first electrode and an edge part surrounding the pressure sensing part, the edge part being fixed on the adapter board by means of a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board defining a cavity. The first electrode and the second electrode of the sensor chip are both electrically connected to the integrated circuit chip by means of the adapter board. L'invention concerne un capteur de pression MEMS, son procédé de f