BENZOCYCLOBUTENE RESIN, RESIN COMPOSITION, AND USE THEREOF

A benzocyclobutene resin, a resin composition, and the use thereof. The benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B, wherein the structural unit A has a structure as represented by Formula I, and the structural unit B has a structure as represented by Formula II. The benzocyclobutene resin has a pure carbon-hydrogen structure and has a sufficiently low dielectric constant Dk and a dielectric loss angle tangent Df. Moreover, the benzocyclobutene resin has a high glass transition temperature, low water absorption, good heat resistance and damp-heat resistance, good dielectric properties, a high modulus and high mechanical properties, and good levels of processability, such that various performance requirements of a high-performance PCB for a resin material can be satisfied. L'invention concerne une résine de benzocyclobutène, une composition de résine et leur utilisation. La résine de benzocyclobutène comprend au moins un motif structural A et au moins un m