PACKAGING METHOD FOR CHIP, AND CHIP PACKAGING STRUCTURE

A packaging method for a chip (30), comprising the following steps: providing a substrate (10), the substrate (10) comprising a base (11) and a plurality of first pads (13) provided on the base (11), and forming a first solder paste (15) on each first pad (13); forming positioning posts (20) on the surface of the base (11) provided with the first pads (13); providing the chip (30), the chip (30) comprising a chip body (31) and a plurality of second pads (33) provided on one surface of the chip body (31), and forming a second solder paste (35) on each second pad (33); forming grooves (32) on the surface of the chip body (31) provided with the second pads (33); accommodating the positioning columns (20) in the grooves (32), each first solder paste (15) being connected to a corresponding second solder paste (35), and melting and solidifying the first solder pastes (15) and the second solder pastes (35) to form solder balls (40) to connect the chip (30) and the substrate (10), thereby forming the chip packaging s