METHOD OF MAKING CURABLE THERMALLY CONDUCTIVE COMPOSITION

A method of making a curable thermally conductive composition and the method contains the steps of: (I) preparing an admixture comprising the following components (A), (B1), (C), (D), and (E) : (A) from 3 weight-percent (wt%) to 10 wt%of a Q-branched alkenyl-functional polyorganosiloxane having at l...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHEN, Chen, BHAGWAGAR, Dorab Edul, ZHU, Junmin, HANSEN, Darren Michael, WEI, Peng, HONG, Debo, ZHENG, Yan
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method of making a curable thermally conductive composition and the method contains the steps of: (I) preparing an admixture comprising the following components (A), (B1), (C), (D), and (E) : (A) from 3 weight-percent (wt%) to 10 wt%of a Q-branched alkenyl-functional polyorganosiloxane having at least three terminally alkenyl groups per molecule and having a viscosity of 25 to 2000 mPas, as determined according to ASTM D445-21 using a glass capillary Cannon-Fenske type viscometer at 25 ℃; (B1) a silyl-hydride functional polysiloxane crosslinker that contains at least two silyl-hydride groups per molecule and that is present at a concentration to provide a molar ratio of silicon-bonded hydrogen atoms in (B1) to alkenyl groups in the Q-branched alkenyl-functional polyorganosiloxane in a range of 0.2 to 0.35; (C) 90 wt%or more of a thermally conductive filler; (D) a filler treating agent; and (E) a platinum-based hydrosilylation reaction catalyst; (II) curing the admixture obtained from step (I) by heat, thereby forming a pre-cured composite; and (III) admixing the pre-cured composite obtained from step (II) with (B2) a silyl-hydride functional polysiloxane crosslinker that contains at least two silyl-hydride groups per molecule; thereby obtaining the curable thermally conductive composition; where a molar ratio of total silicon-bonded hydrogen atoms in the silyl-hydride functional polysiloxane crosslinkers (B1) and (B2) to alkenyl groups in the Q-branched alkenyl-functional polyorganosiloxane (A) is greater than 0.45; and where weight-percentages are relative to the curable thermally conductive composition weight. L'invention concerne un procédé de fabrication d'une composition thermoconductrice durcissable et le procédé comprenant les étapes consistant à : (I) préparer un mélange contenant les composants (A), (B1), (C), (D) et (E) suivants : (A) de 3 pour cent en poids (% en poids) à 10% en poids d'un polyorganosiloxane à fonctionnalité alcényle ramifié en Q ayant au moins trois groupes alcényle terminaux par molécule et ayant une viscosité de 25 à 2000 mPas, telle que déterminée selon la norme ASTM D445-21 à l'aide d'un viscosimètre de type Cannon-Fenske capillaire en verre à 25°C ; (B1) un agent de réticulation de polysiloxane fonctionnel d'hydrure de silyle qui contient au moins deux groupes hydrure de silyle par molécule et qui est présent à une concentration pour fournir un rapport molaire d'atomes d'hydrogène liés au silicium dans (B1) à des group