BONDING LAYER AND PROCESS

A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second substrate. The method includes bonding the first substrate to th...

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Bibliographische Detailangaben
Hauptverfasser:	GILDEA, Adam, MIMURA, Yuji, LEFEVRE, Scott, MADELONE, Sophia, HOSHINO, Satohiko
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method includes providing a first bonding surface on a first substrate, the first bonding surface including a bonding layer that is thermally curable or photocurable. The method includes providing a second bonding surface on a second substrate. The method includes bonding the first substrate to the second substrate by making physical contact between the first bonding surface and second bonding surface. The method further includes applying thermal energy or light to the bonding layer Un procédé comprend la fourniture d'une première surface de liaison sur un premier substrat, la première surface de liaison comprenant une couche de liaison qui est thermodurcissable ou photodurcissable. Le procédé comprend la fourniture d'une seconde surface de liaison sur un second substrat. Le procédé comprend la liaison du premier substrat au second substrat par réalisation d'un contact physique entre la première surface de liaison et la seconde surface de liaison. Le procédé comprend en outre l'application d'énergie thermique ou de lumière à la couche de liaison