INTEGRATED APPARATUS, DETECTION APPARATUS, TERMINAL AND MANUFACTURING METHOD

An integrated apparatus, a detection apparatus, a terminal and a manufacturing method, which relate to the technical field of electronics, and are used for solving the problems of heat dissipation of a sensing chip, and chip stress which is prone to occurring. The integrated apparatus comprises: a substrate layer, a sensing chip and a PCB, wherein the sensing chip is disposed on the substrate layer; the PCB is disposed on the substrate layer and is provided with an opening; the sensing chip is located in the opening, and the sensing chip is connected to the PCB by means of a transmission line; and the difference value between the coefficient of thermal expansion (CTE) of the substrate layer and the CTE of the sensing chip is less than a first preset threshold value. In this way, heat dissipation of a sensing chip can be rapidly implemented by means of a substrate layer, and under the same temperature difference, it can be ensured that the amount of deformation of the substrate layer is generally consistent wi