ACTIVE MICROELECTRONIC ASSEMBLY CONTAINING A DECOUPLING CAPACITOR

A microelectronic assembly comprising a semiconductor structure (e.g., IC chip) and an active interposer that is electrically connected to the semiconductor structure and contains an electronic component embedded within an insulating material. The assembly also comprises a decoupling capacitor that...

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Bibliographische Detailangaben
1. Verfasser: DESCLOS, Laurent
Format: Patent
Sprache:eng ; fre
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