HEAT DISSIPATION APPARATUS, ELECTRONIC DEVICE AND ELECTRIC DEVICE

A heat dissipation apparatus (1), an electronic device (2), and an electric device (3). The heat dissipation apparatus (1) comprises a liquid cooling plate (11) and heat exchange fins (12). The liquid cooling plate (11) is provided with a first surface (111) and a second surface (112) which are oppo...

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Bibliographische Detailangaben
Hauptverfasser:	GUO, Liangyin, GAN, Shaopeng, CHEN, Yati, ZHAO, Zhihao
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat dissipation apparatus (1), an electronic device (2), and an electric device (3). The heat dissipation apparatus (1) comprises a liquid cooling plate (11) and heat exchange fins (12). The liquid cooling plate (11) is provided with a first surface (111) and a second surface (112) which are oppositely arranged, and a first side surface (113) connecting the first surface (111) and the second surface (112), the first surface (111) being used for mounting an electronic device, and the heat exchange fins (12) being arranged on the second surface (112). A cooling flow channel (114) is provided in the liquid cooling plate (11), and the liquid cooling plate (11) is further provided with a liquid inlet (1131) and a liquid outlet (1132) on the first side surface (113), the liquid inlet (1131) and the liquid outlet (1132) separately communicating with the interior of the cooling flow channel (114). Therefore, the heat dissipation apparatus (1) improves the structural strength and further enhances the heat dissipati