PICKERING EMULSION COMPOSITION FOR HEAT DISSIPATION, HEAT DISSIPATION PASTE USING SAME, AND METHOD FOR MANUFACTURING SAME

The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat dissipation comprising: a silicone oil; an aliphatic alcohol; an...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM, Chae Bin, JO, Yong Su, MIN, Seong Bae
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat dissipation comprising: a silicone oil; an aliphatic alcohol; and a thermally conductive filler, and a heat dissipation paste based on the Pickering emulsion and a method for manufacturing same. The thermally conductive filler in the Pickering emulsion forms a segregated network structure, securing high thermal conductivity and stability, and thus the emulsion can be used as a heat dissipation material in various fields. In addition, the filler can be recovered from the heat dissipation paste by using a simple centrifugation method and recycled. La présente invention concerne une composition d'émulsion de Pickering pour dissipation de chaleur, une pâte de dissipation de chaleur l'utilisant, et son procédé de fabrication et, plus spécifiquement, concerne une composition d'émulsion de Pickering pour dissipation de chaleur comprenant : une huile de silicone ; un alcool aliphatique ; et une charge thermoconductrice, et une pâte de dissipation de chaleur basée sur l'émulsion de Pickering et son procédé de fabrication. La charge thermoconductrice dans l'émulsion de Pickering forme une structure de réseaux séparés, assurant une conductivité thermique et une stabilité élevées, et ainsi l'émulsion peut être utilisée en tant que matériau de dissipation de chaleur dans divers domaines. De plus, la charge peut être récupérée de la pâte de dissipation de chaleur à l'aide d'un procédé de centrifugation simple et recyclée. 본 발명은 방열용 피커링 에멀젼 조성물, 이를 이용한 방열 페이스트 및 이의 제조방법에 관한 것으로, 보다 상세하게는 실리콘 오일; 지방족 알콜; 및 열전도성 필러를 포함하는, 방열용 피커링 에멀젼 조성물, 상기 피커링 에멀젼 기반 방열 페이스트 및 이의 제조방법을 제공한다. 상기 피커링 에멀젼 내 열전도성 필러가 segregated network 구조를 형성함으로써, 높은 열전도도 및 안정성을 확보할 수 있고, 이에 따라 다양한 분야의 방열 소재로 활용할 수 있다. 또한, 간단한 원심분리법을 이용해 방열 페이스트로부터 필러 회수 및 재활용이 가능하다.