BIMETALLIC FACEPLATE FOR SUBSTRATE PROCESSING

A bimetallic faceplate for substrate processing is provided including a plate having a plurality of gas distribution holes and formed of a first metal having a first coefficient of thermal expansion, the plate having at least one groove around a center of the plate and spaced from the center of the...

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Bibliographische Detailangaben
Hauptverfasser:	SHRIVASTAVA, Gaurav, YANG, Yao-Hung, HARAPANHALLI, Pavankumar Ramanand, CHANG, Chih-Yang, GONDHALEKAR, Sudhir R
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A bimetallic faceplate for substrate processing is provided including a plate having a plurality of gas distribution holes and formed of a first metal having a first coefficient of thermal expansion, the plate having at least one groove around a center of the plate and spaced from the center of the plate; and a metallic element disposed in the at least one groove and fixed to the plate in the at least one groove, the metallic element having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, the metallic element being symmetrically arranged on or in the plate. A chamber for substrate processing is provided that includes a bimetallic faceplate. Also, a method of making a bimetallic faceplate is provided. L'invention concerne une plaque frontale bimétallique pour le traitement de substrats, comprenant une plaque ayant une pluralité de trous de distribution de gaz et formée d'un premier métal ayant un premier coefficient de dilatation thermique, la plaque ayant au moins une rainure autour d'un centre de la plaque et espacée du centre de la plaque; et un élément métallique disposé dans la/les rainure(s) et fixé à la plaque dans la/les rainure(s), l'élément métallique ayant un second coefficient de dilatation thermique différent du premier coefficient de dilatation thermique, l'élément métallique étant disposé symétriquement sur ou dans la plaque. Une chambre de traitement de substrat comprend une plaque frontale bimétallique. L'invention concerne également un procédé de fabrication d'une plaque frontale bimétallique.