PLASMA INDUCED CRYSTALLIZATION AND DENSIFICATION OF AMORPHOUS COATINGS

A method for coating a substrate and a respectively coated substrate. The created coating is characterized by a crystalline and dense structure which is particularly suitable for applying further layers of coatings onto it. The method uses a plasma for curing the applied solution instead of a therma...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	STUCKENHOLZ, Stefanie, GOENUELLUE, Yakup, BREUNIG, Sonja Mareike, RUDIGIER-VOIGT, Eveline, XIE, Fang Tong, MANGOLD, Stephanie
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for coating a substrate and a respectively coated substrate. The created coating is characterized by a crystalline and dense structure which is particularly suitable for applying further layers of coatings onto it. The method uses a plasma for curing the applied solution instead of a thermal curing and is, hence, faster, less energy consuming, and applicable to more temperature sensitive substrates. L'invention concerne un procédé de revêtement d'un substrat et un substrat respectivement revêtu. Le revêtement créé est caractérisé par une structure cristalline et dense qui est particulièrement appropriée pour appliquer d'autres couches de revêtements sur celle-ci. Le procédé utilise un plasma pour durcir la solution appliquée au lieu d'un durcissement thermique et est, par conséquent, plus rapide, moins consommateur d'énergie, et applicable à plus de substrats sensibles à la température.