BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

A bonding method for bonding substrates together, the method comprising: (a) a step for moving a first holding part and a second holding part relative to each other by a movement mechanism so as to cause a first substrate being held on the undersurface of the first holding part and a second substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WAKAMOTO, Yukihiro, MATUO, Yuhei, KOHAMA, Norifumi, SAIKI, Keiichi, FUKUSHIMA, Hideyuki, NAKAMITSU, Takashi
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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