COMPONENT COOLER FOR A COMPUTING DEVICE

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat trans...

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Bibliographische Detailangaben
Hauptverfasser:	HELBERG, Christopher M, JAGGERS, Christopher M, PRATAPGARHWALA, Mustansir M, RADKE, Robert Edward, AUSTIN, Michael J, SHENOY, Sukesh
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING COMBINED HEATING AND REFRIGERATION SYSTEMS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PHYSICS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES STEAM OR VAPOUR CONDENSERS WEAPONS
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