DEPOSITION MASK FOR OLED PIXEL DEPOSITION

A deposition mask according to an embodiment comprises a metal plate in which a first surface and a second surface opposite to the first surface are defined, wherein the metal plate comprises a deposition area and a non-deposition area, the deposition area comprises a valid area and a invalid area,...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Kweon Jin, KWON, Ki Young
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition mask according to an embodiment comprises a metal plate in which a first surface and a second surface opposite to the first surface are defined, wherein the metal plate comprises a deposition area and a non-deposition area, the deposition area comprises a valid area and a invalid area, the valid area has arranged therein a small surface hole formed on the first surface, a large surface hole formed on the second surface, and a plurality of through-holes formed by a connection unit that connects the small surface hole and the large surface hole, the small surface hole has a step height defined therein, the step height being defined as a height of an area in which a width of the small surface hole increases as the small surface hole extends in a direction toward the first surface from the connection unit, and the step height of the small surface hole is 0 μm. Un masque de dépôt selon un mode de réalisation comprend une plaque métallique dans laquelle une première surface et une seconde surface opposée à la première surface sont définies, la plaque métallique comprenant une zone de dépôt et une zone de non-dépôt, la zone de dépôt comprenant une zone valide et une zone invalide, la zone valide comportant un petit trou formé sur la première surface, un grand trou formé sur la seconde surface, et une pluralité de trous traversants formés par une unité de raccordement qui relie le petit trou et le grand trou, le petit trou ayant une hauteur de profil définie dans celui-ci, la hauteur de profil étant définie comme une hauteur d'une zone dans laquelle une largeur du petit trou augmente à mesure que ce dernier s'étend dans une direction vers la première surface à partir de l'unité de raccordement, et la hauteur de profil du petit trou étant de 0 µm. 실시예에 따른 증착용 마스크는, 제 1 면 및 상기 제 1 면과 반대되는 제 2 면이 정의되는 금속판을 포함하고, 상기 금속판은 증착 영역 및 비증착 영역을 포함하고, 상기 증착 영역은 유효 영역 및 비유효 영역을 포함하고, 상기 유효 영역에는 상기 제 1 면 상에 형성되는 소면공, 상기 제 2 면 상에 형성되는 대면공 및 상기 소면공 및 상기 대면공을 연결하는 연결부에 의해 형성되는 복수의 관통홀이 배치되고, 상기 소면공은 상기 연결부에서 상기 제 1 면 방향으로 연장하면서 상기 소면공의 폭이 넓어지는 영역의 높이로 정의되는 단차 높이가 정의되고, 상기 소면공의 단차 높이는 0㎛이다.