SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE UNIT

A semiconductor module according to one aspect of the present disclosure comprises: a first substrate; a second substrate; and a third heat dissipation member. The first substrate is provided with a first semiconductor element on one main surface thereof and is provided with a first heat dissipation...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TSURUOKA Yasuo
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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