ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES
A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first app...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YOON, Jongmin KIM, Musul JUNG, Sangchul |
| description | A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first application processor and the second application processor; a first fan corresponding to the first application processor; a second fan corresponding to the second application processor; a third fan corresponding to the first display; and a fourth fan corresponding to the second display.
Un dispositif habitronique selon un mode de réalisation peut comprendre : un boîtier ; un premier dispositif d'affichage disposé dans une zone du boîtier ; un second dispositif d'affichage disposé dans une autre zone du boîtier ; un dissipateur thermique ; un premier processeur d'application ; un second processeur d'application ; le dissipateur thermique étant disposé pour faire face au premier processeur d'application et au second processeur d'application ; un premier ventilateur correspondant au premier processeur d'application ; un deuxième ventilateur correspondant au second processeur d'application ; un troisième ventilateur correspondant au premier dispositif d'affichage ; et un quatrième ventilateur correspondant au second dispositif d'affichage.
일 실시예에 따른, 웨어러블(wearable) 장치는 하우징, 상기 하우징의 일 영역에 배치되는 제1 디스플레이, 상기 하우징의 다른 영역에 배치되는 제2 디스플레이, 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서, 상기 제2 어플리케이션 프로세서, 상기 제1 어플리케이션 프로세서 및 상기 제2 어플리케이션 프로세서를 향하도록 배치된 상기 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서에 대응하는 제1 팬(fan), 상기 제2 어플리케이션 프로세서에 대응하는 제2 팬(fan), 상기 제1 디스플레이에 대응하는 제3 팬, 및 상기 제2 디스플레이에 대응하는 제4 팬을 포함할 수 있다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2024058459A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2024058459A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2024058459A13</originalsourceid><addsrcrecordid>eNrjZAhw9XF1Dgny9_N0VnBxDfN0dlVw9HNR8HUN8fB3UXDzD1Jw8QwO9gxwDPH0c1fwcHUMUXAL8vdVCPAJDXL08QyJVPB3gwgH-4cGObsG8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-HB_IwMjEwNTCxNTS0dDY-JUAQAXsy_e</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES</title><source>esp@cenet</source><creator>YOON, Jongmin ; KIM, Musul ; JUNG, Sangchul</creator><creatorcontrib>YOON, Jongmin ; KIM, Musul ; JUNG, Sangchul</creatorcontrib><description>A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first application processor and the second application processor; a first fan corresponding to the first application processor; a second fan corresponding to the second application processor; a third fan corresponding to the first display; and a fourth fan corresponding to the second display.
Un dispositif habitronique selon un mode de réalisation peut comprendre : un boîtier ; un premier dispositif d'affichage disposé dans une zone du boîtier ; un second dispositif d'affichage disposé dans une autre zone du boîtier ; un dissipateur thermique ; un premier processeur d'application ; un second processeur d'application ; le dissipateur thermique étant disposé pour faire face au premier processeur d'application et au second processeur d'application ; un premier ventilateur correspondant au premier processeur d'application ; un deuxième ventilateur correspondant au second processeur d'application ; un troisième ventilateur correspondant au premier dispositif d'affichage ; et un quatrième ventilateur correspondant au second dispositif d'affichage.
일 실시예에 따른, 웨어러블(wearable) 장치는 하우징, 상기 하우징의 일 영역에 배치되는 제1 디스플레이, 상기 하우징의 다른 영역에 배치되는 제2 디스플레이, 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서, 상기 제2 어플리케이션 프로세서, 상기 제1 어플리케이션 프로세서 및 상기 제2 어플리케이션 프로세서를 향하도록 배치된 상기 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서에 대응하는 제1 팬(fan), 상기 제2 어플리케이션 프로세서에 대응하는 제2 팬(fan), 상기 제1 디스플레이에 대응하는 제3 팬, 및 상기 제2 디스플레이에 대응하는 제4 팬을 포함할 수 있다.</description><language>eng ; fre ; kor</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240321&DB=EPODOC&CC=WO&NR=2024058459A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240321&DB=EPODOC&CC=WO&NR=2024058459A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOON, Jongmin</creatorcontrib><creatorcontrib>KIM, Musul</creatorcontrib><creatorcontrib>JUNG, Sangchul</creatorcontrib><title>ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES</title><description>A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first application processor and the second application processor; a first fan corresponding to the first application processor; a second fan corresponding to the second application processor; a third fan corresponding to the first display; and a fourth fan corresponding to the second display.
Un dispositif habitronique selon un mode de réalisation peut comprendre : un boîtier ; un premier dispositif d'affichage disposé dans une zone du boîtier ; un second dispositif d'affichage disposé dans une autre zone du boîtier ; un dissipateur thermique ; un premier processeur d'application ; un second processeur d'application ; le dissipateur thermique étant disposé pour faire face au premier processeur d'application et au second processeur d'application ; un premier ventilateur correspondant au premier processeur d'application ; un deuxième ventilateur correspondant au second processeur d'application ; un troisième ventilateur correspondant au premier dispositif d'affichage ; et un quatrième ventilateur correspondant au second dispositif d'affichage.
일 실시예에 따른, 웨어러블(wearable) 장치는 하우징, 상기 하우징의 일 영역에 배치되는 제1 디스플레이, 상기 하우징의 다른 영역에 배치되는 제2 디스플레이, 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서, 상기 제2 어플리케이션 프로세서, 상기 제1 어플리케이션 프로세서 및 상기 제2 어플리케이션 프로세서를 향하도록 배치된 상기 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서에 대응하는 제1 팬(fan), 상기 제2 어플리케이션 프로세서에 대응하는 제2 팬(fan), 상기 제1 디스플레이에 대응하는 제3 팬, 및 상기 제2 디스플레이에 대응하는 제4 팬을 포함할 수 있다.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhw9XF1Dgny9_N0VnBxDfN0dlVw9HNR8HUN8fB3UXDzD1Jw8QwO9gxwDPH0c1fwcHUMUXAL8vdVCPAJDXL08QyJVPB3gwgH-4cGObsG8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-HB_IwMjEwNTCxNTS0dDY-JUAQAXsy_e</recordid><startdate>20240321</startdate><enddate>20240321</enddate><creator>YOON, Jongmin</creator><creator>KIM, Musul</creator><creator>JUNG, Sangchul</creator><scope>EVB</scope></search><sort><creationdate>20240321</creationdate><title>ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES</title><author>YOON, Jongmin ; KIM, Musul ; JUNG, Sangchul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2024058459A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YOON, Jongmin</creatorcontrib><creatorcontrib>KIM, Musul</creatorcontrib><creatorcontrib>JUNG, Sangchul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOON, Jongmin</au><au>KIM, Musul</au><au>JUNG, Sangchul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES</title><date>2024-03-21</date><risdate>2024</risdate><abstract>A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first application processor and the second application processor; a first fan corresponding to the first application processor; a second fan corresponding to the second application processor; a third fan corresponding to the first display; and a fourth fan corresponding to the second display.
Un dispositif habitronique selon un mode de réalisation peut comprendre : un boîtier ; un premier dispositif d'affichage disposé dans une zone du boîtier ; un second dispositif d'affichage disposé dans une autre zone du boîtier ; un dissipateur thermique ; un premier processeur d'application ; un second processeur d'application ; le dissipateur thermique étant disposé pour faire face au premier processeur d'application et au second processeur d'application ; un premier ventilateur correspondant au premier processeur d'application ; un deuxième ventilateur correspondant au second processeur d'application ; un troisième ventilateur correspondant au premier dispositif d'affichage ; et un quatrième ventilateur correspondant au second dispositif d'affichage.
일 실시예에 따른, 웨어러블(wearable) 장치는 하우징, 상기 하우징의 일 영역에 배치되는 제1 디스플레이, 상기 하우징의 다른 영역에 배치되는 제2 디스플레이, 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서, 상기 제2 어플리케이션 프로세서, 상기 제1 어플리케이션 프로세서 및 상기 제2 어플리케이션 프로세서를 향하도록 배치된 상기 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서에 대응하는 제1 팬(fan), 상기 제2 어플리케이션 프로세서에 대응하는 제2 팬(fan), 상기 제1 디스플레이에 대응하는 제3 팬, 및 상기 제2 디스플레이에 대응하는 제4 팬을 포함할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; kor |
| recordid | cdi_epo_espacenet_WO2024058459A1 |
| source | esp@cenet |
| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS |
| title | ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T09%3A18%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOON,%20Jongmin&rft.date=2024-03-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2024058459A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |