ELECTRONIC DEVICE AND METHOD FOR DISSIPATING HEAT FROM PLURALITY OF HEAT SOURCES

A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first app...

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Bibliographische Detailangaben
Hauptverfasser: YOON, Jongmin, KIM, Musul, JUNG, Sangchul
Format: Patent
Sprache:eng ; fre ; kor
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Zusammenfassung:A wearable device according to one embodiment may comprise: a housing; a first display disposed in one area of the housing; a second display disposed in another area of the housing; a heatsink; a first application processor; a second application processor; the heatsink disposed to face the first application processor and the second application processor; a first fan corresponding to the first application processor; a second fan corresponding to the second application processor; a third fan corresponding to the first display; and a fourth fan corresponding to the second display. Un dispositif habitronique selon un mode de réalisation peut comprendre : un boîtier ; un premier dispositif d'affichage disposé dans une zone du boîtier ; un second dispositif d'affichage disposé dans une autre zone du boîtier ; un dissipateur thermique ; un premier processeur d'application ; un second processeur d'application ; le dissipateur thermique étant disposé pour faire face au premier processeur d'application et au second processeur d'application ; un premier ventilateur correspondant au premier processeur d'application ; un deuxième ventilateur correspondant au second processeur d'application ; un troisième ventilateur correspondant au premier dispositif d'affichage ; et un quatrième ventilateur correspondant au second dispositif d'affichage. 일 실시예에 따른, 웨어러블(wearable) 장치는 하우징, 상기 하우징의 일 영역에 배치되는 제1 디스플레이, 상기 하우징의 다른 영역에 배치되는 제2 디스플레이, 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서, 상기 제2 어플리케이션 프로세서, 상기 제1 어플리케이션 프로세서 및 상기 제2 어플리케이션 프로세서를 향하도록 배치된 상기 히트 싱크(heatsink), 상기 제1 어플리케이션 프로세서에 대응하는 제1 팬(fan), 상기 제2 어플리케이션 프로세서에 대응하는 제2 팬(fan), 상기 제1 디스플레이에 대응하는 제3 팬, 및 상기 제2 디스플레이에 대응하는 제4 팬을 포함할 수 있다.