METHOD FOR MANUFACTURING A STRUCTURE FOR TRANSFERRING CHIPS

The invention relates to a method for manufacturing a transfer structure (100) comprising the following steps: i) providing an intermediate substrate (110); ii) bonding chips (121, 122) to a first surface of an intermediate substrate (110), whereby a tiling of chips (121, 122) is formed, the chips (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FOURNEL, Frank, SANCHEZ, Loic, BALLY, Laurent, CASTAN, Clément, DECHAMP, Jérôme
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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