MICROPHONE CHIP AND MICROPHONE

The present application relates to the technical field of condenser microphones, in particular to a microphone chip and a microphone. The microphone chip comprises: a substrate with a front cavity; and a capacitance system, which is arranged on the substrate, and comprises a diaphragm located at an upper part of the substrate and a back plate spaced apart from the diaphragm, wherein an air gap is formed between the diaphragm and the back plate, and the diaphragm and the back plate are connected to the substrate by means of a fixing portion. The diaphragm comprises an inner diaphragm portion, an outer diaphragm portion and a supporting portion, wherein the inner diaphragm portion and the outer diaphragm portion are spaced apart, and the supporting portion is connected to the fixing portion and the inner diaphragm portion or connected to the fixing portion and the outer diaphragm portion. The microphone chip further comprises a supporting piece, which is connected to the back plate and located between the back