CENTERING WAFER FOR PROCESSING CHAMBER

Processing chambers, substrate supports, centering wafers and methods of center calibrating wafer hand-off are described. A centering wafer comprises a disc-shaped body having a top surface and a bottom surface defining a thickness, a center, an outer edge having an outer peripheral face, a first ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUSTAFA, Muhannad, BALUJA, Sanjeev
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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