CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION

CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION

A wireless chip-to-chip device includes a first semiconductor substrate comprising a first antenna, configured to emit a radiofrequency signal; a second semiconductor substrate comprising a second antenna and configured to receive the radiofrequency signal; and a waveguide, positioned between the fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RAHMAN, Mehnaz, YANG, Tae Young, KIPNIS, Issy, HORINE, Bryce, ACIKALIN, Tolga, DOGIAMIS, Georgios
Format: Patent
Sprache:eng ; fre
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
SEMICONDUCTOR DEVICES
TRANSMISSION
WAVEGUIDES
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Beschreibung
Zusammenfassung:A wireless chip-to-chip device includes a first semiconductor substrate comprising a first antenna, configured to emit a radiofrequency signal; a second semiconductor substrate comprising a second antenna and configured to receive the radiofrequency signal; and a waveguide, positioned between the first semiconductor substrate and the second semiconductor substrate. Un dispositif puce à puce sans fil comprend un premier substrat semi-conducteur comprenant une première antenne conçue pour émettre un signal radiofréquence ; un second substrat semi-conducteur comprenant une seconde antenne conçue pour recevoir le signal radiofréquence ; et un guide d'ondes positionné entre le premier substrat semi-conducteur et le second substrat semi-conducteur.