METHOD FOR MANUFACTURING CIRCUIT BOARD

Provided is a method for manufacturing a circuit board (1) provided with an insulating layer (3), the method comprising a step for forming a via hole (4) by irradiating the circuit board (1) with an excimer laser having a pulse width of 30 microseconds or less and an output of 300 mJ/cm2 or greater....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YONEDA Kazuyoshi, KOH Meiten, NAKADA Kazutaka
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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