SEMICONDUCTOR DEVICE AND LAYERED STRUCTURE

A semiconductor device according to an embodiment of the present disclosure comprises: a semiconductor chip provided with a first pad, a first wiring, and a first insulating film; a second insulating film disposed on the semiconductor chip and having a flat surface; and a second pad disposed on the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUJIMAGARI, Junichiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!