SYSTEM AND METHOD TO MAP THICKNESS VARIATIONS OF SUBSTRATES IN MANUFACTURING SYSTEMS

Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted throu...

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Bibliographische Detailangaben
Hauptverfasser:	VAEZ-IRAVANI, Mehdi, PRABHU, Gopalakrishna, EGAN, Todd
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted through) the substrate. The detected intensity values are used to determine a profile of a thickness of the substrate. Des modes de réalisation divulgués concernent, entre autres, un système et un procédé de balayage d'un substrat avec un faisceau de lumière et de détection pour chaque emplacement d'un ensemble d'emplacements du substrat, un ensemble respectif d'un ensemble de valeurs d'intensité associées à un faisceau de lumière réfléchi par (ou transmis à travers) le substrat. Les valeurs d'intensité détectées sont utilisées pour déterminer un profil d'une épaisseur du substrat.