LEVELING AGENT, AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT PATTERNS, COMPRISING SAME

The present invention relates to a leveling agent and an electroplating composition comprising same, the leveling agent allowing plating process to be controlled such that, during the formation of circuit patterns, the circuit patterns are of equal height even if the circuit patterns vary in line width. La présente invention concerne un agent de nivellement et une composition de placage électrolytique le comprenant, l'agent de nivellement permettant de commander le processus de placage de telle sorte que, pendant la formation de motifs de circuit, les motifs de circuit sont de même hauteur même si les motifs de circuit varient en largeur de ligne. 본 발명은 회로패턴을 형성하는 과정에서 회로패턴 간의 선폭이 다양하더라도 회로패턴 간에 균일한 높이를 갖도록 도금 과정을 제어하는 레벨링제; 및 이를 포함하는 전기도금 조성물에 관한 것이다.