LEAD FRAME COMPRISING LEAD HAVING GROOVE FORMED THEREON

An aspect of the present invention provides a lead frame comprising a lead having a lead groove formed thereon and a dambar disposed between the leads to connect the leads, wherein the dambar disposed between the leads has at least two thickness values, and a dambar groove is formed between the larg...

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Bibliographische Detailangaben
Hauptverfasser:	SEO, Seok Kyu, CHOI, Byoungchul, WOO, Do Yeon
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An aspect of the present invention provides a lead frame comprising a lead having a lead groove formed thereon and a dambar disposed between the leads to connect the leads, wherein the dambar disposed between the leads has at least two thickness values, and a dambar groove is formed between the largest thickness part among parts of the dambar and the lead adjacent to the largest thickness part among the parts of the dambar. Un aspect de la présente invention concerne une grille de connexion comprenant un conducteur sur lequel est formée une rainure, et une barre de retenue disposée entre les conducteurs afin de les relier, la barre de retenue disposée entre les conducteurs présentant au moins deux valeurs d'épaisseur, et une rainure de barre de retenue est formée entre les parties à l'épaisseur la plus grande parmi les parties de la barre de retenue et le conducteur adjacent à la partie à l'épaisseur la plus grande parmi les parties de la barre de retenue. 본 발명의 일 측면에 따르면, 리드 홈이 형성된 리드와, 상기 각 리드 사이에 배치되어 상기 리드를 연결하는 댐바를 포함하고, 상기 각 리드 사이에 배치되는 댐바의 두께는, 적어도 2개의 두께값을 가지고, 상기 댐바의 부분 중 가장 두꺼운 부분과 상기 댐바의 부분 중 가장 두꺼운 부분과 이웃하는 상기 리드 사이에는, 댐바 홈이 형성되어 있는 리드 프레임을 제공한다.