METHOD FOR FORMING CHIP PACKAGE STRUCTURE

Provided in the present invention is a method for forming a chip package structure, comprising: providing a plurality of dies carried on a stretchable layer, the arrangement of the dies on the stretchable layer maintaining the arrangement of a wafer after dicing; stretching the stretchable layer unt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE, Lei, TAN, Fuyao
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!