MEDICAL DEVICE, ELECTRONIC MODULE AND METHOD FOR PRODUCING SAME

A cost-effective method for producing an electronic module of high quality is described, comprising the following steps: providing an electronic circuit board (1) having a first side and an opposing second side and at least one first electrical contact element (2) located at the surface at its first side, a thermoplastic element (3, 30) comprising electrically conducting particles (3.1) or electrically conducting micro-structures (3.2) and an electronic component (4) having a first side and an opposing second side and comprising at least one second electrical contact element (4.1) located at the surface at its second side; arranging the electronic circuit board (1), the thermoplastic element (3, 30) and the electronic component (4) in such a way, that the thermoplastic element (3, 30) is being arranged in between the first electrical contact element (2) and the second electrical contact element (4.1); and thermocompression bonding of the electronic component (4) to the electronic circuit board (1) using the thermoplastic element (3, 30) such that the second side of the electronic component (4) is firmly attached to the first side of the electronic circuit board (1) via the thermoplastic element (3), wherein the thermoplastic element (3, 30) thereby, at the same time, establishes an electrically conductive connection between the at least one first electrical contact element (2) and the at least one second electrical contact element (4.1). Further, a respective electronic module is illustrated and a medical device comprising such electronic module. L'invention concerne un procédé économique de fabrication d'un module électronique de haute qualité, comprenant les étapes suivantes : la fourniture d'une carte de circuit électronique (1) ayant un premier côté et un second côté opposé et au moins un premier élément de contact électrique (2) situé au niveau de la surface sur son premier côté, un élément thermoplastique (3, 30) comprenant des particules électroconductrices (3.1) ou des microstructures électroconductrices (3.2) et un composant électronique (4) ayant un premier côté et un second côté opposé et comprenant au moins un second élément de contact électrique (4.1) situé au niveau de la surface sur son second côté ; l'agencement de la carte de circuit électronique (1), de l'élément thermoplastique (3, 30) et du composant électronique (4) de telle sorte que l'élément thermoplastique (3, 30) est disposé entre le premier élément de contact électrique (2) et le