LASER WELDING DEVICE AND WELDING METHOD USING SAME

LASER WELDING DEVICE AND WELDING METHOD USING SAME

The present invention provides a laser welding device and a welding method using same, the laser welding device comprising: a lower jig; a laser welding part for welding a metal, which is disposed on the upper surface of a PCB disposed above the lower jig, to another separate metal; and an upper jig...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KWON, Jae Kuk, JANG, Jae Young, LEE, Jin Hyun, JUNG, Dae Ho, HWANG, Jo Yeon
Format: Patent
Sprache:eng ; fre ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:The present invention provides a laser welding device and a welding method using same, the laser welding device comprising: a lower jig; a laser welding part for welding a metal, which is disposed on the upper surface of a PCB disposed above the lower jig, to another separate metal; and an upper jig for supporting one or more of at least a part of the upper surface of the PCB, at least a part of the upper surface of the metal, and at least a part of the upper surface of said another metal, wherein the upper jig is fixed to have a constant vertical position, or when the upper jig moves upward or downward, the upper jig may be fixed at a specific position. Moreover, the present invention relates to a laser welding device capable of welding a PCB while vibrating, and a welding method using same. La présente invention concerne un dispositif de soudage au laser et un procédé de soudage l'utilisant, le dispositif de soudage au laser comprenant : un gabarit inférieur ; une partie de soudage au laser pour souder un métal, qui est disposé sur la surface supérieure d'une carte à circuit imprimé (PCB) placée au-dessus du gabarit inférieur, à un autre métal séparé ; et un gabarit supérieur pour supporter au moins une partie de la surface supérieure de la PCB, et/ou au moins une partie de la surface supérieure du métal, et/ou au moins une partie de la surface supérieure dudit autre métal, le gabarit supérieur étant fixé pour avoir une position verticale constante, ou lorsque le gabarit supérieur se déplace vers le haut ou vers le bas, il peut être fixé à une position spécifique. De plus, la présente invention concerne un dispositif de soudage au laser permettant de souder une PCB tout en vibrant, et un procédé de soudage l'utilisant. 본원발명은 하부지그, 상기 하부지그의 상부에 배치된 PCB의 상면에 배치된 금속을 별도의 타금속과 용접하는 레이저 용접부, 및 상기 PCB 상면의 적어도 일부, 상기 금속 상면의 적어도 일부, 및 상기 타금속 상면의 적어도 일부 중 하나 이상을 지지하는 상부지그를 포함하는 레이저 용접장치에 있어서, 상기 상부지그는 고정되어 상하 위치가 일정하거나, 상기 상부지그가 상하로 이동할 경우 특정 위치에 고정될 수 있는 레이저 용접장치 및 이를 이용한 용접방법에 관한 것이다. 본원발명은 또한 PCB를 진동하면서 용접할 수 있는 레이저 용접장치 및 이를 이용한 용접방법에 관한 것이다. 대표도 : 도 4