ELECTRICALLY CONDUCTIVE LOW-TEMPERATURE-CURABLE SILICONE ADHESIVE COMPOSITION FOR IMPROVING ELECTRICAL CONDUCTIVITY

The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED package junction, the composition being curable at a low temperature...

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Bibliographische Detailangaben
Hauptverfasser:	BYUN, Sang Hyun, HWANG, Da Wool
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an electrically conductive low-temperature-curable adhesive composition. Specifically, the present invention relates to an electrically conductive thermosetting silicone adhesive composition for LED package junction, the composition being curable at a low temperature of 100°C or lower in order to attach an LED terminal to a printed circuit board (PCB), and enabling excellent electrical conductivity to be implemented after curing and, simultaneously, having the excellent effect of dissipating heat from an LED junction part to the outside thereof. La présente invention concerne une composition adhésive durcissable à basse température électriquement conductrice. Spécifiquement, la présente invention concerne une composition adhésive de silicone thermodurcissable électroconductrice pour jonction de boîtier de DEL, la composition étant durcissable à une basse température s'élevant à 100°C ou moins afin de fixer une borne de DEL à une carte imprimée (PCB), et permettant la mise en œuvre d'une excellente conductivité électrique après durcissement et, simultanément, ayant l'excellent effet de dissipation thermique d'une partie de jonction de DEL vers l'extérieur de celle-ci. 본 발명은 저온 경화형 실리콘 전기 전도성 접착제 조성물에 관한 것이다. 구체적으로, 본 발명은 인쇄회로기판(PCB) 기판에 LED 단자를 부착하기 위해 100℃ 이하의 저온에서 경화 가능하고 경화 후 우수한 전기 전도도를 구현할 수 있는 동시에 LED 접합부에서 외부로의 방열 효과가 우수한 LED 패키지 접합용 열경화형 실리콘 전기 전도성 접착제 조성물에 관한 것이다.