UV LED CURABLE HOTMELT PRESSURE SENSITIVE ADHESIVE COMPOSITION

The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention. La présente inventio...

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Bibliographische Detailangaben
Hauptverfasser:	TADEN, Andreas, ARNOLD, Moritz, ROSCHKOWSKI, Thomas, SCHNEIDER, Anja
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention refers to a UV LED curable hotmelt pressure sensitive adhesive composition, a method for its production as well as an article comprising a first substrate and a second substrate adhered to each other with the adhesive composition according to the invention. La présente invention concerne une composition adhésive sensible à la pression thermofusible durcissable par DEL UV, un procédé pour sa production ainsi qu'un article comprenant un premier substrat et un second substrat collés l'un à l'autre avec la composition adhésive selon l'invention.