SUB-PAD FOR POLISHING PAD, POLISHING PAD INCLUDING SAME, AND METHOD FOR MANUFACTURING SUB-PAD FOR POLISHING PAD

The present invention provides a sub-pad for a polishing pad, a polishing pad including same, and a method for manufacturing the sub-pad for a polishing pad, the sub-pad being stacked under a top pad that contacts and polishes a wafer and including a nanofiber non-woven fabric pad, wherein the nanof...

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Bibliographische Detailangaben
Hauptverfasser:	EOM, Youn Sick, MIN, Byung Ju, KANG, Min Woo, OH, Nam Gue, KIM, Seung Geun, JEONG, Ji Hun, KIM, San Ha
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a sub-pad for a polishing pad, a polishing pad including same, and a method for manufacturing the sub-pad for a polishing pad, the sub-pad being stacked under a top pad that contacts and polishes a wafer and including a nanofiber non-woven fabric pad, wherein the nanofiber density of an outer circumferential part of the nanofiber non-woven fabric pad is 1.2-5 times that of another part inside the outer circumferential part. La présente invention concerne un sous-tampon pour un tampon de polissage, un tampon de polissage comprenant celui-ci, et un procédé de fabrication du sous-tampon pour un tampon de polissage, le sous-tampon étant empilé sous un tampon supérieur qui entre en contact avec une tranche et polit celle-ci, et comprenant un tampon de tissu non-tissé de nanofibres, la densité de nanofibres d'une partie périphérique externe du tampon de tissu non-tissé de nanofibres étant 1,2 à 5 fois celle d'une autre partie à l'intérieur de la partie périphérique externe. 본 발명은 웨이퍼와 접촉하여 연마를 수행하는 탑패드(Top-pad)의 하부에 적층되는 서브패드로서, 나노섬유 부직포 패드를 포함하며, 상기 나노섬유 부직포 패드는 외주부의 나노섬유 밀도가 외주부 안쪽의 다른 부분의 나노섬유 밀도보다 1.2 배 내지 5배로 형성된, 연마패드용 서브패드, 이를 포함하는 연마패드, 및 상기 연마패드용 서브패드의 제조방법을 제공한다.