PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

Certain embodiments of the present disclosure relate to a sensor assembly including a housing having a first channel configured to flow a gas in a first direction and a second channel configured to flow the gas in a second direction. The housing is configured to couple to a gas flow assembly. A subs...

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Bibliographische Detailangaben

Hauptverfasser:	KRISHNAMURTHY, Srikanth, XU, Ming, OKADA, Ashley M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME PHYSICS SEMICONDUCTOR DEVICES TESTING
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