POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL MULTILAYER BODY

The present invention provides a polyimide precursor composition for flexible wiring boards, the polyimide precursor composition containing a polyimide precursor that has a repeating unit represented by general formula (I). A polyimide film, which has a low dielectric loss tangent in a high frequenc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IIZUMI Nobu, FUKATA Hiroto, YAMAJI Kosuke, IWAMOTO Keiji
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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