SEMICONDUCTOR DEVICE

[Problem] To provide a semiconductor device in which a stress applied to a glass substrate can be decreased and an end section of the glass substrate can be sufficiently protected. [Solution] A semiconductor device according to the present embodiment comprises: a glass substrate including a first su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ADACHI Kiwamu, SEKI Kousuke, MITARAI Shun, IGARASHI Takahiro
Format: Patent
Sprache:eng ; fre ; jpn
Schlagworte:
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