METHOD AND APPARATUS FOR DETERMINING ARRANGEMENT OF UNITS CONNECTED WITH BUMPS

A method and apparatus for determining an arrangement of units connected with bumps. The method for determining the arrangement of units connected with bumps comprises: acquiring input information, the input information comprising bump information of multiple bumps and IO unit constraint information...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, Tinghou, ZHANG, Jun, LIU, Yakun, SHU, Qin, ZHAO, Chenxi
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method and apparatus for determining an arrangement of units connected with bumps. The method for determining the arrangement of units connected with bumps comprises: acquiring input information, the input information comprising bump information of multiple bumps and IO unit constraint information; determining an IO unit arrangement on the basis of the input information, the IO unit arrangement comprising multiple IO units used to connect with the multiple bumps, and the IO unit arrangement satisfying the constraint information; and outputting information of the IO unit arrangement. Determining an IO unit arrangement on the basis of bump information and constraint information does not require manual arrangement and adjustment, which can shorten the time consumed by IO arrangement, and improve processing efficiency. Procédé et appareil de détermination d'un agencement d'unités connectées à des mémoires annexes. Le procédé de détermination de l'agencement d'unités connectées à des mémoires annexes consiste :