SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Provided is a substrate processing device for processing a substrate, the substrate processing device comprising: a substrate holding portion having a holding surface for the substrate; a rotating mechanism for rotating the substrate on the holding surface centered on the axis of rotation of the sub...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMASHITA, Yohei, YAMAWAKI, Yohei
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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