SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

Provided is a substrate processing device for processing a substrate, the substrate processing device comprising: a substrate holding portion having a holding surface for the substrate; a rotating mechanism for rotating the substrate on the holding surface centered on the axis of rotation of the sub...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA, Yohei, YAMAWAKI, Yohei
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a substrate processing device for processing a substrate, the substrate processing device comprising: a substrate holding portion having a holding surface for the substrate; a rotating mechanism for rotating the substrate on the holding surface centered on the axis of rotation of the substrate holding portion; and a laser irradiation portion for irradiating the substrate on the holding surface with a laser beam. The holding surface of the substrate holding portion has a diameter smaller than that of the substrate. L'invention concerne un dispositif de traitement de substrat pour traiter un substrat, le dispositif de traitement de substrat comprenant : une partie de retenue de substrat ayant une surface de retenue pour le substrat ; un mécanisme de rotation pour faire tourner le substrat sur la surface de retenue centrée sur l'axe de rotation de la partie de retenue de substrat ; et une partie d'irradiation laser pour irradier le substrat sur la surface de retenue avec un faisceau laser. La surface de retenue de la partie de retenue de substrat a un diamètre inférieur à celui du substrat. 基板を処理する基板処理装置であって、前記基板の保持面を有する基板保持部と、前記基板保持部の回転軸を中心として前記保持面上の基板を回転させる回転機構と、前記保持面上の前記基板にレーザ光を照射するレーザ照射部と、を備え、前記基板保持部の前記保持面は、前記基板と比較して小径である。