MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER

A member 1 for forming wiring comprises an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition that contains conductive particles 12, a thermosetting resin, and a maleimide compound. The metal layer 20 is disposed upon the adhesive layer 10. L'in...

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Bibliographische Detailangaben
Hauptverfasser:	AKAI Kunihiko, FUJIMOTO Daisuke, ITOH Yuka, TAKAGI Shunsuke, TAKANO Nozomu, OHKOSHI Masashi, IZAWA Hiroyuki, KOTAKE Tomohiko
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A member 1 for forming wiring comprises an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition that contains conductive particles 12, a thermosetting resin, and a maleimide compound. The metal layer 20 is disposed upon the adhesive layer 10. L'invention concerne un élément 1 pour former un câblage comprenant une couche adhésive 10 et une couche métallique 20. La couche adhésive 10 est composée d'une composition adhésive qui contient des particules conductrices 12, une résine thermodurcissable et un composé maléimide. La couche métallique 20 est disposée sur la couche adhésive 10. 配線形成用部材１は、接着剤層１０と金属層２０とを備える。接着剤層１０は、導電性粒子１２と熱硬化性樹脂とマレイミド化合物とを含む接着剤組成物から構成される。金属層２０は、接着剤層１０上に配置される。