DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND DEVICE INTEGRATION

A device includes a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL...

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Bibliographische Detailangaben
Hauptverfasser:	VADHAVKAR, Sameer Sunil, YUN, Changhan Hobie, THADESAR, Paragkumar Ajaybhai, PARK, Nosun, KIM, Daniel Daeik
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A device includes a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL substrate. Un dispositif comprend un substrat de couche de redistribution (RDL). Le dispositif comprend également un composant passif dans le substrat RDL à proximité d'une première surface du substrat RDL. Le dispositif comprend en outre une première puce couplée à une seconde surface du substrat RDL, opposée à la première surface du substrat RDL.