METHOD OF JOINING ELECTRICAL AND MECHANICAL COMPONENTS USING LAMINATED MODULAR PREFORMS

A method of applying a sinterable film to a substrate during a surface mount technology (SMT) process, the method comprising: providing a substrate; providing a preform comprising a support film, the support film having a first surface and a second surface opposite the first surface, the support fil...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KHASELEV, Oscar, SINGH, Bawa, FENECH, Maurizio, SETNA, Rohan, SOCARRAS, Andres, SIEBENHUHNER, Matthew
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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