ADHESIVE

The present application can provide an adhesive suitable for a flexible device and a device comprising same. According to one embodiment, the present application can provide an adhesive which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, Hui Je, MIN, Jin Seo, PARK, Byung Su, KIM, Byeong Ho
Format: Patent
Sprache:eng ; fre ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:The present application can provide an adhesive suitable for a flexible device and a device comprising same. According to one embodiment, the present application can provide an adhesive which is applied to a flexible device to effectively respond to repeated deformation and recovery, does not cause defects before and after deformation, and has excellent recovery properties. La présente demande concerne un adhésif convenant à un dispositif souple et un dispositif le comprenant. Selon un mode de réalisation, la présente demande peut porter sur un adhésif qui est appliqué sur un dispositif souple pour répondre efficacement à des cycles répétés de déformation et de recouvrance, ne provoque aucun défaut avant et après déformation et présente d'excellentes propriétés de recouvrance. 본 출원에서는 플렉서블 디바이스에 적합한 점착제 및 그를 포함하는 디바이스를 제공할 수 있다. 하나의 예시에서 본 출원에서는 플렉서블 디바이스에 적용되어 반복되는 변형과 회복에 효과적으로 대응하고, 변형 전후에 불량을 유발하지 않으며, 회복성도 우수한 점착제을 제공할 수 있다.