ANISOTROPIC CONDUCTIVE ADHESIVE FOR FLEXIBLE CIRCUIT BOARD

An embodiment of the present invention provides: an adhesive resin composition comprising substituted or unsubstituted dicyclopentadiene and a substituted or unsubstituted acrylic compound and having a storage modulus of 100 Pa to 1000 Pa at 100°C to 300°C; and self-assembling anisotropic conductive...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, Eun Hye, LEE, Kyung Sub, JEONG, So Un
Format:	Patent
Sprache:	eng ; fre ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An embodiment of the present invention provides: an adhesive resin composition comprising substituted or unsubstituted dicyclopentadiene and a substituted or unsubstituted acrylic compound and having a storage modulus of 100 Pa to 1000 Pa at 100°C to 300°C; and self-assembling anisotropic conductive adhesive comprising the adhesive resin composition, leading to an effect of having excellent adhesion even in a flexible display or a semiconductor device. Un mode de réalisation de la présente invention concerne : une composition de résine adhésive comprenant du dicyclopentadiène substitué ou non substitué et un composé acrylique substitué ou non substitué et ayant un module de conservation de 100 Pa à 1000 Pa à une température comprise entre 100 °C et 300 °C ; et un adhésif conducteur anisotrope à auto-assemblage comprenant la composition de résine adhésive, résultant en une excellente adhérence même dans un dispositif d'affichage souple ou un dispositif à semi-conducteur. 본 발명의 일실시예는 치환 또는 비치환된 디사이클로펜타디엔; 및 치환 또는 비치환된 아크릴계 화합물;을 포함하고, 100℃ 이상 300℃ 이하에서 저장탄성률이 100Pa 이상 1000Pa 이하인 것을 특징으로 하는, 접착수지조성물과, 상기 접착수지조성물을 포함하는 자가조립형 이방성 도전접착제를 제공하여, 플렉서블 디스플레이 또는 반도체 기판에서도 우수한 접착력을 가지는 효과를 제공한다.