PHOTOSENSITIVE RESIN COMPOSITION

This photosensitive resin composition comprises a thermoplastic elastomer (A), a liquid farnesene rubber (B), an ethylenic unsaturated compound (C), and a photoinitiator (D). Cette composition de résine photosensible comprend un élastomère thermoplastique (A), un caoutchouc de farnésène liquide (B),...

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Bibliographische Detailangaben
Hauptverfasser:	UENO, Yoshikazu, UEHARA, Yosuke
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTING PRINTING PLATES OR FOILS STAMPS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	This photosensitive resin composition comprises a thermoplastic elastomer (A), a liquid farnesene rubber (B), an ethylenic unsaturated compound (C), and a photoinitiator (D). Cette composition de résine photosensible comprend un élastomère thermoplastique (A), un caoutchouc de farnésène liquide (B), un composé insaturé éthylénique (C) et un photoinitiateur (D). 熱可塑性エラストマー（Ａ）、液状ファルネセン系ゴム（Ｂ）、エチレン性不飽和化合物（Ｃ）、及び光開始剤（Ｄ）を含む感光性樹脂組成物。