EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

An epoxy resin composition according to the present invention contains an epoxy resin, a curing agent, an inorganic filler and a silicone compound; and the silicone compound is configured so as to satisfy the relational expression (viscosity A) < (viscosity B), where (viscosity A) is the viscosit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIRAGAMI, Masashi, KANG, Dongchul, UCHIYAMA, Chika, IKEDA, Tomohiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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