POLYMERIC SUBLAYER - FORMULATION BASED ON RESINS HAVING HIGH THERMOMECHANICAL PROPERTIES (PEEK, PES, PAI, PBI, ETC) FOR REINFORCING THE MECHANICAL RESISTANCE, IN PARTICULAR TO HEAT, OF FLUORINATED COATINGS

The present invention relates to a tie sublayer of a release coating on a metal support, characterized in that it comprises: a) between 20% and 80% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of polyaryletherketones (PAEK), polyethyleneimi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	GANTILLON, Barbara
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES APPARATUS FOR MAKING BEVERAGES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COFFEE MILLS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DOMESTIC ARTICLES OR APPLIANCES DYES FILLING PASTES FURNITURE HUMAN NECESSITIES INKS KITCHEN EQUIPMENT METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPICE MILLS SPRAYING OR ATOMISING IN GENERAL SUCTION CLEANERS IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to a tie sublayer of a release coating on a metal support, characterized in that it comprises: a) between 20% and 80% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of polyaryletherketones (PAEK), polyethyleneimines (PEI), polyimides (PI), polyamide imides (PAI) and polybenzymidazoles (PBI), with a weight ratio PAEK: (PEI+PI+PAI+PBI) of between 1:1 and 15:1, b) at least 20%, preferably at least 25% by weight of the total weight of the sublayer of one or more polymers selected from the group consisting of phenylene polysulfides (PPS) and polyethersulfones (PES), c) less than 40%, preferably less than 30% by weight of the total weight of the sublayer of reinforcing inorganic fillers, preferably between 5% and 25% by weight, d) between 0% and 5% by weight of the total weight of the sublayer of one or more fluorocarbon or acrylic resins, e) optionally one or more pigments. La présente invention concerne une sous-couche d'accroche d'un revêtement antiadhésif sur un support métallique caractérisée en ce qu'elle comprend : a) entre 20 % et 80 % en poids du poids total de la sous-couche d'un ou plusieurs polymère(s) choisis dans le groupe constitué des polyaryléthercétones (PAEK), des polyéthylèneimines (PEI), des polyimides (PI), des polyamide imides (PAI) et des polybenzymidazole (PBI), avec un ratio en poids PAEK: (PEI+PI+PAI+PBI ) compris entre 1 :1 et 15:1, b) au moins 20 %, de préférence au moins 25 %, en poids du poids total de la sous-couche d'un ou plusieurs polymères choisi(s) dans le groupe constitué des polysulfures de phénylène (PPS) et des polyethersulfones (PES), c) moins de 40 %, de préférence moins de 30 %, en poids du poids total de la sous-couche de charges inorganiques de renfort, de préférence entre 5 et 25 % en poids, d) entre 0 et 5 % en poids du poids total de la sous-couche d'une ou plusieurs résine(s) fluorocarbonée(s) ou acrylique(s), e) éventuellement un ou plusieurs pigments.