PACKAGING STRUCTURE, CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

A packaging structure (1), a circuit board assembly and an electronic device. The packaging structure (1) comprises a substrate (10), an electronic component (20) and a packaging cover body (50), wherein the substrate (10) has a first surface and a second surface, which are oppositely arranged, and...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, Shiyu, SUN, Tuobei, MEI, Na, YANG, Dan
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A packaging structure (1), a circuit board assembly and an electronic device. The packaging structure (1) comprises a substrate (10), an electronic component (20) and a packaging cover body (50), wherein the substrate (10) has a first surface and a second surface, which are oppositely arranged, and the electronic component (20) is connected to the first surface of the substrate (10); the packaging cover body (50) comprises a top cover (510), a first supporting portion (521) and a second supporting portion (522); the top cover (510) is connected to the first surface of the substrate (10) by means of the first supporting portion (521) and the second supporting portion (522); a first cavity (530) is defined between the first supporting portion (521) and the second supporting portion (522); and the top cover (510) is provided with an opening (511) at a location corresponding to the electronic component (20), and at least part of the electronic component (20) is exposed from the opening (511). La présente divulgat