POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME
The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazo...
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| creator | PARK, Joon Chul PARK, Se Joo LEE, Ik Sang |
| description | The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.
La présente divulgation concerne une composition d'acide polyamique comprenant : un acide polyamique comprenant, en tant que motif de polymérisation, au moins un élément choisi parmi un monomère dianhydride représenté par la formule chimique 1 et un monomère diamine représenté par la formule chimique 2 ou la formule chimique 3 ; un composé à base d'imidazole ; un composé à base d'époxy ; et un solvant organique, et un polyimide la comprenant. La composition d'acide polyamique de la présente divulgation et le polyimide la comprenant présentent d'excellentes propriétés mécaniques telles que la résistance et l'allongement tout en conservant un faible indice de jaune et d'excellentes propriétés thermiques. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023101329A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023101329A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023101329A13</originalsourceid><addsrcrecordid>eNrjZHAO8PeJdPT1dFZwdPZ0UXD29w3wD_YM8fT3U3D0c1EAyXr6erq4Krh5-vgqBAS5BjgGuboohHuGeCiEeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDI2NDA0NjI0tHQ2PiVAEAx6YsKA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME</title><source>esp@cenet</source><creator>PARK, Joon Chul ; PARK, Se Joo ; LEE, Ik Sang</creator><creatorcontrib>PARK, Joon Chul ; PARK, Se Joo ; LEE, Ik Sang</creatorcontrib><description>The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.
La présente divulgation concerne une composition d'acide polyamique comprenant : un acide polyamique comprenant, en tant que motif de polymérisation, au moins un élément choisi parmi un monomère dianhydride représenté par la formule chimique 1 et un monomère diamine représenté par la formule chimique 2 ou la formule chimique 3 ; un composé à base d'imidazole ; un composé à base d'époxy ; et un solvant organique, et un polyimide la comprenant. La composition d'acide polyamique de la présente divulgation et le polyimide la comprenant présentent d'excellentes propriétés mécaniques telles que la résistance et l'allongement tout en conservant un faible indice de jaune et d'excellentes propriétés thermiques.</description><language>eng ; fre</language><subject>ADVERTISING ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; GENERAL PROCESSES OF COMPOUNDING ; LABELS OR NAME-PLATES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PHYSICS ; SEALS ; SIGNS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230608&DB=EPODOC&CC=WO&NR=2023101329A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230608&DB=EPODOC&CC=WO&NR=2023101329A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK, Joon Chul</creatorcontrib><creatorcontrib>PARK, Se Joo</creatorcontrib><creatorcontrib>LEE, Ik Sang</creatorcontrib><title>POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME</title><description>The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.
La présente divulgation concerne une composition d'acide polyamique comprenant : un acide polyamique comprenant, en tant que motif de polymérisation, au moins un élément choisi parmi un monomère dianhydride représenté par la formule chimique 1 et un monomère diamine représenté par la formule chimique 2 ou la formule chimique 3 ; un composé à base d'imidazole ; un composé à base d'époxy ; et un solvant organique, et un polyimide la comprenant. La composition d'acide polyamique de la présente divulgation et le polyimide la comprenant présentent d'excellentes propriétés mécaniques telles que la résistance et l'allongement tout en conservant un faible indice de jaune et d'excellentes propriétés thermiques.</description><subject>ADVERTISING</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LABELS OR NAME-PLATES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PHYSICS</subject><subject>SEALS</subject><subject>SIGNS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAO8PeJdPT1dFZwdPZ0UXD29w3wD_YM8fT3U3D0c1EAyXr6erq4Krh5-vgqBAS5BjgGuboohHuGeCiEeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDI2NDA0NjI0tHQ2PiVAEAx6YsKA</recordid><startdate>20230608</startdate><enddate>20230608</enddate><creator>PARK, Joon Chul</creator><creator>PARK, Se Joo</creator><creator>LEE, Ik Sang</creator><scope>EVB</scope></search><sort><creationdate>20230608</creationdate><title>POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME</title><author>PARK, Joon Chul ; PARK, Se Joo ; LEE, Ik Sang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023101329A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>ADVERTISING</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LABELS OR NAME-PLATES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SIGNS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK, Joon Chul</creatorcontrib><creatorcontrib>PARK, Se Joo</creatorcontrib><creatorcontrib>LEE, Ik Sang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK, Joon Chul</au><au>PARK, Se Joo</au><au>LEE, Ik Sang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME</title><date>2023-06-08</date><risdate>2023</risdate><abstract>The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.
La présente divulgation concerne une composition d'acide polyamique comprenant : un acide polyamique comprenant, en tant que motif de polymérisation, au moins un élément choisi parmi un monomère dianhydride représenté par la formule chimique 1 et un monomère diamine représenté par la formule chimique 2 ou la formule chimique 3 ; un composé à base d'imidazole ; un composé à base d'époxy ; et un solvant organique, et un polyimide la comprenant. La composition d'acide polyamique de la présente divulgation et le polyimide la comprenant présentent d'excellentes propriétés mécaniques telles que la résistance et l'allongement tout en conservant un faible indice de jaune et d'excellentes propriétés thermiques.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADVERTISING AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION GENERAL PROCESSES OF COMPOUNDING LABELS OR NAME-PLATES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEALS SIGNS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME |
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