DEVICE FOR CLEANING EDGE OF WAFER USING PLASMA

The present application provides a device for cleaning the edge of a wafer using plasma. The device comprises: a fixing assembly, which is used for bearing and fixing a passive surface of a wafer; and an upper insulating assembly, which is located in an area on the side of the wafer where an active...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, Jun, HE, Minbo
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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