DEVICE FOR CLEANING EDGE OF WAFER USING PLASMA

The present application provides a device for cleaning the edge of a wafer using plasma. The device comprises: a fixing assembly, which is used for bearing and fixing a passive surface of a wafer; and an upper insulating assembly, which is located in an area on the side of the wafer where an active...

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Bibliographische Detailangaben
Hauptverfasser:	LIN, Jun, HE, Minbo
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present application provides a device for cleaning the edge of a wafer using plasma. The device comprises: a fixing assembly, which is used for bearing and fixing a passive surface of a wafer; and an upper insulating assembly, which is located in an area on the side of the wafer where an active surface is located and is used for protecting a core area on the active surface of the wafer. The upper insulating assembly comprises an upper insulating ring and an insulating cover plate, wherein the upper insulating ring is located on the outer side of the insulating cover plate and is connected to the insulating cover plate; the distance between the upper insulating ring and the active surface of the wafer is controllable; and the upper insulating ring comprises a sealing ring, the sealing ring comprises a flexible component, and the flexible component is used for causing the sealing ring to be in flexible contact with the active surface of the wafer. By means of the device, the present application can effectiv